Samsung, Intel widen AI chip battle into memory, packaging

DIGITIMESAugust 26, 2026en

Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports cited by Counterpoint Research said Samsung is using high-bandwidth memory (HBM) to strengthen its foundry business, while Intel is expanding from logic chips and foundry services into memory through advanced packaging and system-level technologies.

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