Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF

DIGITIMESOctober 16, 2026en

Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory (HBM) directly above graphics processors and SK Hynix advancing high-bandwidth flash (HBF) to expand memory capacity for AI inference.

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