SK hynix outlines CPO roadmap as AI computing shifts from chips to systems

DIGITIMESAugust 21, 2026en

SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics , positioning the world's largest supplier of high-bandwidth memory (HBM) to compete not just on individual chip performance but on how memory, processors, and networking are designed together as AI computing systems scale.

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