SK Hynix resumes DDR4, DDR5 packaging orders with Winpac

DIGITIMESSeptember 30, 2026en

SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023 as the memory maker increases the volume of flip-chip packaging handled by external partners.

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