Sumitomo Bakelite expands packaging material production across Singapore, China

DIGITIMESOctober 12, 2026en

Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This is expected to approximately double its production capacity for mold underfill (MUF) materials and approximately triple that for compression-molding granules.

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