Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins

DIGITIMESSeptember 4, 2026en

Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with a smart-factory solution combining automated material handling systems (AMHS), overhead hoist transport (OHT), and AI-powered digital twins, allowing packaging and testing facilities to automate without extensive reconstruction.

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