TSMC anchors Kaohsiung's Baipu Park as ASE expansion spurs phase-two development

DIGITIMESen

TSMC anchors Kaohsiung's Baipu Park as ASE expansion spurs phase-two development

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park in Kaohsiung, where construction has formally begun on what is billed as Taiwan's first advanced packaging supply-chain cluster. Led by TSMC, the park's first phase has already been fully allocated, and a groundbreaking ceremony on September 21 drew more than 20 semiconductor companies, including TSMC, Foxconn, and ASE.

This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.

Read the full story at DIGITIMES

    Related AI news