TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM

DIGITIMESOctober 14, 2026en

GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem. The US$2 billion, five-year agreement will expand advanced packaging capacity and support growing demand for artificial intelligence (AI) and high-performance computing (HPC) technologies.

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