TSMC's 310mm push threatens Samsung's PLP lead

DIGITIMESAugust 26, 2026en

Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and high-performance computing. But the next phase of PLP competition may depend less on who moved first than on which rectangular panel format equipment makers, materials suppliers and OSATs ultimately build around, and activity around 310×310mm is growing in Taiwan.

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