TSMC turns to OSATs for more CoW capacity as AI packaging bottleneck persists

DIGITIMESAugust 6, 2026en

Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test (OSAT) providers, according to ETNews , which cited semiconductor industry sources.

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