UMC targets 12-inch TFLN to break 400G SiPh bottleneck

DIGITIMESSeptember 2, 2026en

As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest contract chipmaker, is expanding its silicon photonics (SiPh) efforts and focusing on thin-film lithium niobate (TFLN) as a core technology for overcoming key bottlenecks, while its SiPh platform has moved into 12-inch production.

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