USI advances optical interconnect push with ELSFP laser module
DIGITIMESen

Universal Scientific Industrial (USI), part of ASE Technology Holding, is expanding its optical interconnect footprint for AI data centers. EugenLight Technologies, in which USI holds a controlling stake, has launched its ultra-high-power (UHP) external laser source form-factor pluggable (ELSFP) module series, targeting high-speed optical interconnect demand in next-generation AI compute clusters, high-performance computing (HPC), and high-density data centers, with mass production scheduled for the first quarter of 2027.
This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.
Read the full story at DIGITIMESRelated AI news
- 欣興涉產地標示爭議遭搜索 AI 載板供需及客戶動向成焦點TechNews (TW) · August 31, 2026
- AI 帶旺晶圓代工 台積電 Q2 市占率達 73% 續稱霸TechNews (TW) · August 31, 2026
- Apple to name John Ternus CEO as AI becomes top priorityTech in Asia · August 31, 2026
- Nvidia supplier Unimicron probed over allegedly relabeling China-made partsNikkei Asia · August 31, 2026
- Chip design startup Agentrys has raised a $19.1M seed round led by Etna Labs and a $5.4M pre-seed led by MediaTek (Chris Metinko/Axios)Techmeme · August 31, 2026
- 全球第一個 AI 法院上線,阿聯率先挑戰司法新紀元TechNews (TW) · August 31, 2026