Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV

DIGITIMESSeptember 21, 2026en

This week’s reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk’s unusual engineering push in Korea and Google’s TPU-driven ASIC demand to equipment shortages and packaging debates that could slow capacity expansion. Taiwan’s Physical AI discussions emphasized system integration over components, while China’s semiconductor researchers outlined a DUV-based sub-3nm GAA path. Beijing also moved to restrict civilian drones starting in November sharply. Below are the most-read DIGITIMES stories from September 14 to September 20, 2026

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