Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout

DIGITIMESSeptember 14, 2026en

AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted openings in IPC and IoT; memory inventories tightened as HBM4 and server demand strained DRAM and NAND supply; and Micron, Taiwan Mobile, Samsung Electronics, ASML, Synopsys and Eaton advanced plans tied to AI, advanced-node manufacturing and higher-density data centers. Below are the most-read DIGITIMES stories from September 7–13, 2026.

This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.