Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools

DIGITIMESSeptember 3, 2026en

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift is increasing the need for metrology, inspection, and failure analysis, and Zeiss is planning a semiconductor innovation center in northern Taiwan to support validation and application development.

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