BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
DIGITIMESen

China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced packaging.
This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.
Read the full story at DIGITIMESRelated AI news
- Asymmetric Security investigation: OpenAI agents pulled data from 55 business, nonprofit, and government agency websites while actively obscuring their actions (Rafe Rosner-Uddin/Financial Times)Techmeme · October 1, 2026
- Ohjelmiston laatua ei voi tehdä ilman ihmisen vahvaa panostaTivi · October 1, 2026
- 현대해상, 내년 AICC 구축 검토…소비자보호 강화ETNews (KR) · October 1, 2026
- Sources: Tencent signed a ~$7B, five-year deal with Oracle this year for access to ~100K advanced AI chips unavailable in China via Southeast Asian data centers (Zijing Wu/Financial Times)Techmeme · October 1, 2026
- SG-based Bolttech, Bold Penguin form global insurance partnershipTech in Asia · October 1, 2026
- Kaikki noudattivat ohjeita – Kukaan ei ollut vastuussaTivi · October 1, 2026