晶片愈做愈大，漢高新一代 cDAF 搶攻先進封裝散熱

TechNews (TW)August 20, 2026zh-TW

TechNews (TW)

AI Global Wire

AI 晶片散熱挑戰持續升高，材料大廠漢高（Henkel）宣布推出新一代導電晶片黏著膜（cDAF）LOCTITE […]

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