Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking

DIGITIMESOctober 16, 2026en

China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms, analysts say, the stakes are different: with US export controls limiting access to the tools needed for leading-edge transistor scaling, stacking and connecting chips more densely has become one of the few routes left to narrow the performance gap, an approach Huawei has framed as its Tau scaling law.

This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.

• Verktyg
• Reglering