Microsoft's 2nm Maia 300 completes cloud AI ASIC lineup, setting up 2027 server supply-chain boom
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Microsoft has unveiled its latest in-house AI application-specific integrated circuit (ASIC), Maia 300, and accompanying server rack, with its compute chiplets manufactured using TSMC's advanced N2P process (an enhanced, extended version of the company's baseline 2nm, or N2). Supply-chain sources indicate that Lenovo, rather than Taiwanese manufacturers, will assemble the Maia 300 server racks.
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