TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration

DIGITIMESAugust 31, 2026en

TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths for its next-generation COUPE platform and outlining a broader role for heterogeneous integration in future co-packaged optics.

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